Date & Time: Thursday, May 3, 2018 at 9:00 am PT

Description:

Most of us have knowledge of PCB construction. In the past reversing someone’s design was an easy task due to the simplicity of the PCB design. Now with BGA’s (Ball Grid Arrays), manufacturers using several plane layers cover the entire PCB design and obscuring the details of the PCB from view. Thru the use of X-Ray, we are able to reverse engineer virtually anything. Slides will be presented showing several PCB designs and how easy it is to reverse engineer the PCB. This webinar will also include videos of live views and dynamic zoom; which will demonstrate the true power of the X-Ray and its ability to see sub-micron features within the PCB structure and devices while manipulating the PCB.

Speaker:

George Tarnovsky has been working as a Design Engineer since the 80’s. His designs for industries such as: Industrial process control instrumentation, Visible light spectroscopy, Semiconductor FAB instrumentation, Smart card security & countermeasures, Automotive systems vulnerability. George holds several patents, has given papers at many internal conferences, and currently continues to expand FPGA designs vulnerability and hardening.